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Capabilities
Layer count:
1-22 layers
Materials:
FR4
Rogers
Arlon
BT
Polymide
Thickness:
0.008 to 0.125 inches
Copper Weight:
1-4 ounce finished
Finish:
Solder level, tin, ENIG
Maximum board dimensions:
17.00 X 23.00 inches
Line width and spaces:
0.005 inches
Plated-through holes:
0.008 - 0.063 diameter (inches), tolerance +/-0.003 inches
0.064 - 0.195 diameter (inches), tolerance +/-0.004 inches
Non-plated-through holes:
0.010 - 0.195 diameter (inches), tolerance +/-0.003 inches
Plated slots:
Tolerance +/-0.003 inches
Route or score:
Tolerance +/-0.005 inches
Gold plating:
Tab: 30 micro-inches gold over 100 micro-inches nickel, beveled 1/32 X 45 degrees.
Flash: 4-6 micro-inches over 40 micro-inches nickel
Solder mask:
Liquid Photoimagable in green, red, blue, black or clear
Silkscreen:
Epoxy in white, yellow or black
Other capabilities:
Countersinking, controlled depth routing, jump scoring, flying probe test, ionic cleaning, Automatic Optical Testing