Materials
Jet Technologies, Inc.
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Electrical |
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Dielectric Constant |
4.7 @ 1 Mhz |
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Dissipation Factor |
0.020 @ 1 Mhz |
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Dielectric Breakdown |
75 KV |
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Arc Resistance |
120 sec. |
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Volume Resistivity |
>1,000,000 megohm-cm |
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Surface Resistivity |
>10,000 megohm |
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Physical |
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Water absorption |
.09% |
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Flexural Strength Length |
85,000 PSI |
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Flexural Strength Cross |
60,000 PSI |
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Peel Strength (1-oz copper) |
10 lb/in |
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Rockwell Hardness |
110 M Scale |
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Underwriters Laboratories |
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Flammability |
UL 94 VO |
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Temperature Index |
130/140 degrees C |
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Maximum Operating Temp |
130 degrees C |
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Solder Limits |
500 degrees F for 40 seconds |
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|
550 degrees F for 20 seconds |
GETEK
Used in place of FR-4 for high maximum
operating temperatures (burn-in boards). Comprised of epoxy and polyphenylene
oxide (PPO). Used for 1,2 and multilayer boards.
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Electrical |
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Dielectric Constant |
3.9 @ 1 Mhz |
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Dissipation Factor |
0.010-0.015 @ 1 Mhz |
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Electrical Strength |
1000-1200 volts/mil |
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Volume Resistivity |
>1,000,000 megohm-cm |
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Surface Resistivity |
>10,000 megohm |
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Physical/font> |
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Water absorption |
0.12% |
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Peel Strength (1-oz copper) |
8-9 lb/in |
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Underwriters Laboratories |
|
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Flammability |
UL 94 VO< |
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Maximum Operating Temp |
150 degrees C |
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Solder Limits |
500 degrees F for 40 seconds |
|
|
550 degrees F for 20 seconds |
RO4003
Superior high frequency performance laminate
for RF/Microwave circuits. Glass reinforced hydrocarbon/ceramic laminate (Not
PTFE).
|
Electrical |
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|
Dielectric Constant |
3.48 +/- 0.05 @ 10 Ghz |
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Dissipation Factor |
0.0022 @ 10 Ghz |
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Dielectric Breakdown |
|
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Arc Resistance |
|
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Volume Resistivity |
>1.7 X 1010 megohm-cm |
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Surface Resistivity |
>4.2 X109 megohm |
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Physical |
|
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Water absorption |
0.06% |
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Flexural Strength Length |
3,700 KPSI/font> |
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Flexural Strength Cross |
3,900 KPSI |
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Peel Strength (1-oz copper) |
5 lb/in |
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Rockwell Hardness |
|
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Underwriters Laboratories |
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Flammability |
No UL94 VO rating |
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Temperature Index |
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Maximum Operating Temp |
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Solder Limits |
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